Job Description:

Job information IC Packaging Engineer from the Company Apple, this latest IC Packaging Engineer job vacancy is located in the city Santa Clara, CA located in the country United States . This latest job opening is open to job seekers who have the latest education / graduate Bachelor Degree . Job Vacancies in this Engineering field have been opened and published up to the specified time.

Job Responsibility:

Summary Posted: Feb 1, 2024 Role Number:200451800 Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results. In this highly impactful role, you will initiate package concepts, own and drive sophisticated package selection, new product package structure and configuration optimization. You will be responsible for packaging integration and package technology development for a variety of projects including SoC. Key Qualifications Key Qualifications

• We are looking for an individual with experience working in the Semiconductor Packaging field.
• Knowledge in materials characterization and analysis.
• Ideal candidate will have proven understanding of Wafer Level Packaging, 2.5D packaging and 3D packaging technology.
• General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
• Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers.
• Ability to work independently and orchestrate projects with minimum supervision.
• Solution-oriented engineer who has proven fundamentals in engineering physics.
• Shown capabilities using package design softwares, APD, Virtuoso, etc.
• Confirmed understanding in memory packaging.
• Good program management skills.
BS and 10+ years of relevant industry experience.

Description Description - Responsible to lead packaging technology development including advanced 2.5D/3D packaging. - Work with multi-functional team and lead SoC Package integration efforts. - Package Architecture / Package Integration Innovation - Work with foundry and OSAT to bring packaging solution from concept to HVM. - Drive industry with sophisticated Package solutions, new material development, and specs. - 5% International travel. Education & Experience Education & Experience BS and 10+ years of relevant industry experience. Additional Requirements Additional Requirements Pay & Benefits Pay & Benefits

• At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $170,700.00 and $300,200.00, and your base pay will depend on your skills, qualifications, experience, and location. Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits. Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program. Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.

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Closed Date : 2025-01-12